Through-hole footprint and mated stack height
The 68692-120HLF: Row spacing is 0.100" (2.54mm), matching the pitch, so the dual-row footprint occupies a 0.100" × 0.100" grid — standard for BergStik-compatible receptacles.

Amphenol ICC (FCI) BERGSTIK® II header, order code 68692-120HLF, 20 positions, dual row, 0.100" (2.54mm) pitch, 3A, gold or GXT™ plated mating contacts, through-hole, solder termination.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Gender | Male Pin |
| Mounting type | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 3A |
| Operating temperature | -65°C~130°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bulk |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 20 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact length - post | 0.100\" (2.54mm) |
| Overall contact length | 0.430\" (10.92mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 68692-120HLF: Row spacing is 0.100" (2.54mm), matching the pitch, so the dual-row footprint occupies a 0.100" × 0.100" grid — standard for BergStik-compatible receptacles.
RoHS and REACH compliance documentation is available from the manufacturer.