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68693-408HLF — Amphenol product photo

68693-408HLF BERGSTIK II Header, 8 Pos, 0.100" Pitch

MPN68693-408HLF
Active

Amphenol ICC (FCI) BERGSTIK® II, 68693-408HLF, unshrouded dual-row header, 8 positions, 0.100" (2.54 mm) pitch, through-hole solder termination, tin-plated contacts, 3 A rating.

$1.5300Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

68693-408HLF Technical Specifications
ParameterValue
SeriesBERGSTIK® II
GenderMale Pin
Mounting typeThrough Hole
Connector typeHeader
Fastening typePush-Pull
Current rating3A
Operating temperature-65°C~130°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions8
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact length - post0.520\" (13.21mm)
Overall contact length0.938\" (23.83mm)
Contact finish - matingTin
Contact length - mating0.318\" (8.08mm)
Contact finish thickness - mating100.0µin (2.54µm)

Product details

Board Fit and Pinout

The 68693-408HLF: All 8 positions are loaded, so the pinout is a simple 2x4 grid.

Current and Temperature Range

The wide temperature floor suits equipment that sees cold soak or thermal cycling.

Plating and Mating Cycles

That is a thick tin layer — good for moderate mating cycles (50-100 cycles typical for tin) in a low-vibration environment.

Mounting and Board Stacking

Frequently asked questions

What is the pinout and pitch of 68693-408HLF?

All positions are loaded.

Can 68693-408HLF be used for board-to-board stacking?

Yes.