The FCI Electronics 68695-150HLF is a 50-position, dual-row BergStik II unshrouded header on the standard 0.100" (2.54 mm) pitch. Rated 5 A per contact with a 110 V voltage rating, it carries gold or Gold GXT™ plating on the mating surface at 30.0 µin (0.76 µm) thickness, which supports repeated mating cycles in signal-level board-to-board duty.
The 0.100" pitch and 0.100" row spacing are the industry-standard 2.54 mm grid — the board footprint is a drop-in for any BergStik II or equivalent unshrouded header pattern. Right-angle through-hole termination means the solder tails extend 0.090" (2.29 mm) below the board — check the board thickness and the opposite-side clearance before layout.
No official cross-reference or replacement is on record, but the BergStik II family is widely second-sourced, so a parametric match from another manufacturer is possible — confirm the footprint and plating grade before substituting.