Board-to-Board Header for Standard-Density Interconnects
The Amphenol 68697-106HLF is a 6-position, dual-row unshrouded header from the BERGSTIK® II series, designed for board-to-board stacking or wire-to-board connections via a mating receptacle. The 0.100" (2.54mm) pitch matches standard DIP footprints, so it fits existing PCB layouts without a redesign. Right-angle through-hole termination places the pin row parallel to the board edge, saving vertical space in compact enclosures. Rated 5A per contact with 30.0µin gold on the mating surface, it handles repeated mating cycles in test or field-service applications. The UL94 V-0 black housing is standard for equipment inside an enclosure.
What the Key Ratings Mean for Your Fit
The 0.100" pitch sets the board footprint — it drops into a standard 0.100" grid without a custom land pattern. The 5A per-contact rating is typical for this pitch class; the limiting factor is the temperature rise in the unshrouded housing, so derate above 25°C ambient per the product drawing. The 30.0µin gold plating on the mating side supports hundreds of mating cycles without fretting, making it a good fit for connections that see periodic disconnect and reconnect. The right-angle orientation means the pins exit parallel to the board — useful for edge-mount or mezzanine layouts where height above the board is constrained.