It uses the standard 0.100" (2.54 mm) pitch on both rows and positions, with a right-angle through-hole termination that places the pin rows parallel to the board edge — a common choice for mezzanine or card-edge connections where vertical clearance above the PCB is limited. The contact finish is 30.0 µin (0.76 µm) gold on the mating surface, paired with phosphor bronze base material, giving it a solid cycle life for repeated mating and unmating in field-service or test-fixture applications.
Positioning and Fit
The 0.100" (2.54 mm) pitch and 0.100" (2.54 mm) row spacing are the classic dual-inline footprint, so the board layout is straightforward if you have used a standard DIP-style header before. The right-angle orientation gives a mated height above the board determined by the mating contact length of 0.230" (5.84 mm) and the insulation height of 0.190" (4.83 mm); the post length below the board is 0.125" (3.18 mm) for the solder tail. No locking feature — the push-pull fastening means the connector stays mated by friction alone, so it is not the right choice for high-vibration environments without additional mechanical retention (e.g., a board standoff or adhesive).
No official manufacturer cross-reference or direct replacement is documented for this order code — the BERGSTIK II series includes many pitch and position variants, but a pin-compatible alternative would need to match the 0.100" pitch, 20 positions, right-angle through-hole, and gold plating to be a form-fit-function swap.
Compliance and Material
The contact material is phosphor bronze with a gold or Gold, GXT™ mating finish at 30.0 µin (0.76 µm) thickness — the gold layer is thick enough to handle repeated mating cycles without exposing the base metal to corrosion in a typical indoor environment. The insulation color is black, and the connector is packaged in a bag.