It uses the industry-standard 0.100" (2.54 mm) pitch, making it footprint-compatible with a wide range of mating receptacles and perf-board layouts. Rated for 5 A per contact at 110 V, this is a general-purpose signal interconnect — the 30.0 µ" gold plating on the mating surface gives it a solid cycle life for repeated connect/disconnect in test, programming, or modular assemblies. The unshrouded design means no polarisation key; the mating half needs to be aligned manually during assembly.
The 0.100" (2.54 mm) pitch is the defining dimension for board layout — it matches standard DIP IC spacing, so this header can sit alongside through-hole ICs on the same grid without a footprint mismatch. The 30.0 µ" gold plating on the mating surface, not the headline current, is what governs real-world reliability: it handles 50+ mating cycles without exposing the base phosphor bronze, making this a better choice than a tin-plated equivalent for a connector that will be unmated and remated during field service or calibration.