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68705-405HLF — Amphenol product photo

FCI 68705-405HLF BERGSTIK II Header, 5-Pos, 0.100" Pitch

MPN68705-405HLF
Active

FCI BERGSTIK® II, Board to Board, Header, 5 Positions, 1 Row, 0.100" (2.54mm) Pitch, Through Hole, Solder, Tin Mating Finish.

$0.9700Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

68705-405HLF Technical Specifications
ParameterValue
SeriesBERGSTIK® II
GenderMale Pin
Mounting typeThrough Hole
Connector typeHeader
Fastening typePush-Pull
Voltage rating110V
Current rating5A
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows1
Pitch0.100\" (2.54mm)
Positions5
Contact length - post0.095\" (2.41mm)
Overall contact length0.395\" (10.03mm)
Contact finish - matingTin
Contact length - mating0.200\" (5.08mm)
Contact finish thickness - mating100.0µin (2.54µm)

Product details

The FCI 68705-405HLF is a 5-position, single-row BERGSTIK® II unshrouded header. All 5 positions are loaded with square male pins in phosphor bronze, finished with 100.0 µ" (2.54 µm) of tin on the mating surface.

Rated 5 A per circuit at 110 V — the 5 A figure is typical for signal-level duty on a 0.100" pitch header; the limiting factor is the temperature rise of the housing, not the contact itself.

The 0.095" (2.41 mm) solder tail length suits standard PCBs; the overall contact length of 0.395" (10.03 mm) sets the through-hole standoff.

Frequently asked questions

What is the pitch of 68705-405HLF?

The pitch is 0.100" (2.54 mm) — the standard DIP footprint that matches common board layouts and legacy perfboard patterns.