Board-to-board header, 14 positions, unshrouded
The 68779-114 is the 14-position member of Amphenol ICC (FCI)'s BERGSTIK® II unshrouded header line, designed for board-to-board stacking. It carries gold or GXT™-plated mating contacts rated 3 A per circuit, with a 0.100" (2.54 mm) pitch and dual-row layout. The through-hole solder termination and push-pull fastening suit applications where the header is soldered directly to the PCB and mated with a matching receptacle.
Footprint and stack dimensions
The 0.100" (2.54 mm) pitch and 0.100" (2.54 mm) row spacing define a standard 0.100" x 0.100" grid footprint common across the BERGSTIK® II series. Mating contact length is 0.318" (8.08 mm), post length is 0.318" (8.08 mm), and overall contact length is 0.736" (18.69 mm) — these dimensions set the board-to-board stack height and through-hole depth.
Active production and sourcing
Sourced per RFQ; no stock-holding claim is made.