Board-to-board unshrouded header
The 69190-109HLF is a 9-position, single-row member of the Amphenol BERGSTIK® II header line. It mates at a 0.100" (2.54 mm) pitch, carries 3 A per contact, and uses gold or GXT™ plating on the mating surface with a 30.0 µin (0.76 µm) thickness. Termination is through-hole press-fit and solder; the unshrouded push-pull interface suits board-to-board stacking where a low-profile connection is needed.
Pitch, footprint, and routing
The 0.100" (2.54 mm) pitch and single-row layout keep the board footprint narrow — the 9 positions occupy a 0.900" (22.86 mm) row of plated through-holes. The insulation height is 0.100" (2.54 mm) above the board, and the overall contact length of 0.450" (11.43 mm) includes a 0.230" (5.84 mm) mating section and a 0.120" (3.05 mm) post. The PCT glass-filled housing carries a UL94 V-0 flammability rating and operates from -65°C to 130°C.