Amphenol BERGSTIK® II header, order code 69190-110HLF, 10 positions, single row, 0.100" (2.54 mm) pitch, 3 A, gold or gold GXT™ mating finish, through-hole press-fit and solder termination.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Gender | Male Pin |
| Mounting type | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 3A |
| Operating temperature | -65°C~130°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bulk |
| Shrouding | Unshrouded |
| Termination | Press-Fit, Solder |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 10 |
| Contact length - post | 0.120\" (3.05mm) |
| Overall contact length | 0.450\" (11.43mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 69190-110HLF is the 10-circuit member of Amphenol's BERGSTIK® II unshrouded header line, a board-to-board interconnect in a single-row 0.100" (2.54 mm) pitch layout. Rated 3 A per contact with a gold or gold GXT™ mating finish (30.0 µin / 0.76 µm thickness), the through-hole press-fit and solder termination suits high-reliability backplane and mezzanine stacks where a low-profile unshrouded connection is required.
The 69190-110HLF is supplied by Amphenol. Quoted to order against the BOM quantity; availability confirmed at RFQ.
The style is Board to Board, and the series is BERGSTIK® II.
The housing carries a UL94 V-0 material flammability rating. RoHS/REACH documentation is available from the manufacturer upon request.