Amphenol ICC (FCI) BERGSTIK® II, 69192-420HLF, unshrouded male pin header, 20 circuits, 0.100" (2.54 mm) pitch, dual-row, tin-plated contacts, through-hole termination, 3 A per contact, UL94 V-0.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Gender | Male Pin |
| Mounting type | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 3A |
| Operating temperature | -65°C~130°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Kinked Pin, Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 20 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.120\" (3.05mm) |
| Overall contact length | 0.450\" (11.43mm) |
| Contact finish - mating | Tin |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - mating | 100.0µin (2.54µm) |
The 69192-420HLF: The through-hole termination with kinked pins (0.120" post length) locks the header into the board during wave solder and resists pull-out from cable strain.
No polarization key, so board layout should account for orientation at assembly. Tin-plated mating surface (100 µinch thickness) and tin-plated solder tails.
Row spacing is also 0.100" (2.54 mm).