Board-to-board receptacle with 30.0µin gold mating surface
The 71609-309: Push-pull fastening, no secondary locking.
No pin-compatible drop-in replacement is documented; a board spin may be required for a functional alternative.
71609-309
Amphenol ICC (FCI) Dubox receptacle, order code 71609-309, 18 positions, dual row, 0.100" (2.54mm) pitch, gold-plated mating contacts, surface-mount right-angle, solder termination.
$0.8600Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
- New & original stockTraceable channels only — no mixed lots, no re-taped reels.
- Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
- Photo-verified countsEvery line counted and photographed before the box closes.
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Specifications
| Parameter | Value |
|---|---|
| Series | Dubox™ |
| Gender | Female Socket |
| Mounting type | Surface Mount, Right Angle |
| Connector type | Receptacle |
| Fastening type | Push-Pull |
| Contact material | Phosphor Bronze |
| Insulation color | Gray |
| Insulation height | 0.230\" (5.85mm) |
| Insulation material | Thermoplastic, Glass Filled |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Tube |
| Termination | Solder |
| Applications | Automotive, General Purpose, Industrial, Telecommunications |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 18 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
Product details
Frequently asked questions
Where can I buy 71609-309 and how do I get a price?
The 71609-309 is available through independent surplus channels.
What is the closest pin-compatible alternative to 71609-309?
No pin-compatible alternative is documented by the manufacturer. The 71609-309 is a dual-row 0.100" pitch SMT receptacle — any functional replacement would require verifying the board footprint, stack height, and mating half compatibility.