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71609-309

71609-309 Amphenol ICC (FCI) Dubox Receptacle, 18 Pos

MPN71609-309
Obsolete

Amphenol ICC (FCI) Dubox receptacle, order code 71609-309, 18 positions, dual row, 0.100" (2.54mm) pitch, gold-plated mating contacts, surface-mount right-angle, solder termination.

$0.8600Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Jul 2026

Specifications

71609-309 key specifications
ParameterValue
SeriesDubox™
TypeFemale Socket
MountingSurface Mount, Right Angle
Connector typeReceptacle
Fastening typePush-Pull
Contact materialPhosphor Bronze
Insulation colorGray
Insulation height0.230\" (5.85mm)
Insulation materialThermoplastic, Glass Filled
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageTube

All specifications

71609-309 additional specifications
ParameterValue
TerminationSolder
ApplicationsAutomotive, General Purpose, Industrial, Telecommunications
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions18
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact finish - matingGold
Contact finish thickness - post78.7µin (2.00µm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

Board-to-board receptacle with 30.0µin gold mating surface

The 71609-309: Push-pull fastening, no secondary locking.

No pin-compatible drop-in replacement is documented; a board spin may be required for a functional alternative.

Frequently asked questions

Where can I buy 71609-309 and how do I get a price?

The 71609-309 is available through independent surplus channels.

What is the closest pin-compatible alternative to 71609-309?

No pin-compatible alternative is documented by the manufacturer. The 71609-309 is a dual-row 0.100" pitch SMT receptacle — any functional replacement would require verifying the board footprint, stack height, and mating half compatibility.