Amphenol ICC (FCI) Dubox™ series, 20-position dual-row female socket header, 0.100" (2.54 mm) pitch, through-hole solder termination, 30.0 µinch gold mating finish, 11.04 mm mated stack height.
| Parameter | Value |
|---|---|
| Series | Dubox™ |
| Type | Female Socket |
| Mounting | Through Hole |
| Connector type | Receptacle, Bottom or Top Entry |
| Fastening type | Push-Pull |
| Contact material | Phosphor Bronze |
| Insulation color | Blue |
| Insulation height | 0.275\" (6.99mm) |
| Insulation material | Thermoplastic, Glass Filled |
| Mated stacking heights | 11.04mm |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Parameter | Value |
|---|---|
| Package | Tube |
| Termination | Solder |
| Applications | Automotive, General Purpose, Industrial, Telecommunications |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 20 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.118\" (3.00mm) |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
No official second-source or cross-reference is published by the manufacturer.
The Dubox™ series offers the same 11.04 mm stack height and 0.100" pitch in 22-position (71991-311LF), 24-position (71991-312LF), and 26-position (71991-313LF) variants — all with identical gold plating and through-hole termination. If the BOM requires more I/O, the 22-position version is a direct drop-in for the same footprint width, while the 24- and 26-position versions widen the board layout.
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