Amphenol ICC (FCI) Dubox 71991-313HLF, 26-position dual-row 0.100" (2.54mm) pitch board-to-board receptacle, female socket, gold-plated mating interface, tin-plated solder post, through-hole push-pull mounting, 11.04 mm mated stack height, UL94 V-0 glass-filled thermoplastic housing.
| Parameter | Value |
|---|---|
| Series | Dubox™ |
| Gender | Female Socket |
| Mounting type | Through Hole |
| Connector type | Receptacle, Bottom or Top Entry |
| Fastening type | Push-Pull |
| Contact material | Phosphor Bronze |
| Insulation color | Gray |
| Insulation height | 0.275\" (6.99mm) |
| Insulation material | Thermoplastic, Glass Filled |
| Mated stacking heights | 11.04mm |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Tube |
| Termination | Solder |
| Applications | Automotive, General Purpose, Industrial, Telecommunications |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 26 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.118\" (3.00mm) |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 71991-313HLF: The through-hole solder posts (3.00 mm length) with 78.7 µinch (2.00 µm) tin finish provide a reliable solder joint for wave-solder assembly.
In vibration environments, consider a header with a locking ramp or add a board-level retention feature.
The base product number 71991 covers the series; other position counts and plating options are available under the same family.
The mated stack height is 11.04 mm — verify the header's post length and board thicknesses to meet the z-height requirement.