Board-to-Board Stacking with Rib-Cage™ III
The 73547-130TRLF is a 60-position, dual-row, surface-mount header from the Rib-Cage™ III series, designed for parallel board stacking at a fixed 9.93 mm mated height. Each contact is rated 1 A at DC, which suits logic-level and sensor signal paths rather than power distribution.
The gold-on-mating, tin-on-tail split is a common choice for connectors that see infrequent disconnection but need a reliable solder joint.
Automated Assembly Features
This header includes a board guide and pick-and-place features, which simplify automated placement and alignment during SMT assembly. The board guide helps locate the part on the PCB before reflow, reducing tombstoning and misalignment risk. The pick-and-place surface allows vacuum nozzles to handle the part reliably in high-volume lines.
Temperature Range and Operating Environment
Rated for operation from -55°C to 130°C, the 73547-130TRLF covers industrial, automotive underhood, and outdoor telecom cabinet environments where the ambient temperature can swing widely. The 1 A current rating should be derated above 85°C per the standard derating curve for thermoplastic housings.