Board-to-Board Header, 8 Positions, 0.100" Pitch
It uses the industry-standard 0.100" (2.54mm) pitch, making it a direct drop-in for breadboard layouts and legacy board-to-board interconnects. Rated for 5A per contact at 110V, with gold GXT™ plating on the mating surface (30.0µin thickness) for corrosion resistance and extended mating cycle life. The through-hole solder termination and 0.400" (10.16mm) post length suit it for standard PCB thicknesses in prototype, test equipment, and low-to-medium density production runs.
The 0.100" (2.54mm) pitch is the most common through-hole header grid — your board footprint needs to match this spacing exactly, and it gives enough room for one signal trace between pads on a standard two-layer board.
Solder termination, through-hole mounting. The insulation height is 0.100" (2.54mm) above the board, and the overall contact length is 0.725" (18.42mm).