Amphenol BERGSTIK® 75160-132-09LF, single-row unshrouded board-to-board header, 9 positions, 0.100" (2.54 mm) pitch, male pin, through-hole solder, gold GXT™ contacts, 5 A, UL94 V-0.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® |
| Gender | Male Pin |
| Mounting type | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Voltage rating | 110V |
| Current rating | 5A |
| Operating temperature | -65°C~130°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bulk |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 9 |
| Contact length - post | 0.120\" (3.05mm) |
| Overall contact length | 0.625\" (15.88mm) |
| Contact finish - mating | Gold, GXT™ |
| Contact length - mating | 0.405\" (10.29mm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The Amphenol BERGSTIK® 75160-132-09LF is a single-row unshrouded board-to-board header with 9 positions on the standard 0.100 inch (2.54 mm) pitch. The black UL94 V-0 thermoplastic body and phosphor bronze contacts suit it for general-purpose board stacking and wire-to-board applications where a reliable, low-cost interconnect is needed.
The 0.100 inch pitch matches standard perfboard and breadboard layouts, so the footprint is straightforward for any board layout engineer.
The pitch is 0.100 inch (2.54 mm), which is the standard breadboard-compatible spacing for this class of header.
This unshrouded header mates with any standard 0.100 inch pitch single-row receptacle or IDC socket that accepts male square pins — the mating half is not a single order code but a class of compatible connectors.