It uses the industry-standard 0.100" (2.54 mm) pitch on a through-hole solder termination, making it a direct fit for legacy board layouts and prototyping grids. Rated 5 A per contact at 110 V, it handles typical signal and low-power I/O duty — the gold GXT™ plating on the mating surface (30.0 µin / 0.76 µm thick) gives it good cycle life for repeated connect-disconnect in test fixtures or field-service access panels.
The 0.100" (2.54 mm) pitch sets the pad pattern — it's the same grid as legacy DIP packages and Berg strip headers, so the footprint is well-known to every PCB layout tool. The 0.225" (5.72 mm) mating pin length gives enough engagement depth for standard box headers and IDC receptacles. The overall contact length of 0.445" (11.30 mm) and a post length of 0.120" (3.05 mm) define the through-hole standoff: the board thickness plus solder tail clearance must fit within that post dimension.
Plating and environmental fit
The 30.0 µin (0.76 µm) gold GXT™ finish on the mating surface is a hardened gold alloy that resists fretting corrosion better than standard soft gold. This matters if the header sees frequent mating cycles — think test points, programming jigs, or field-replaceable modules. The UL94 V-0 rated thermoplastic housing and -65°C to 130°C operating range make it suitable for enclosed industrial equipment and outdoor telecom cabinets where flame rating and wide thermal tolerance are required.