It uses the industry-standard 0.100" (2.54mm) pitch on both rows and between rows, making it a direct footprint match for a wide range of legacy and current board-to-board or cable interconnect designs. The header is through-hole soldered and carries gold GXT™ plating on the mating surface at 30.0µin (0.76µm) thickness, rated for 5A per contact at 110V.
The 0.100" (2.54mm) pitch is the most common grid in through-hole PCB design — your board layout for a 12-position, dual-row header is a 2x6 pattern on 0.100" centers. The gold GXT™ plating at 30.0µin is a robust choice for applications requiring 200+ mating cycles or exposure to mildly corrosive environments — significantly more durable than standard tin plating for repeated field service.