The Amphenol 75844-118-10LF is a 10-position, dual-row unshrouded breakaway header from the BERGSTIK® series. It uses the standard 0.100" (2.54 mm) pitch and row spacing, making it footprint-compatible with a wide range of legacy and current board layouts. The through-hole solder termination and push-pull fastening suit it for wire-to-board or board-to-board signal interconnect where the header is soldered permanently to the PCB and the mating half is a crimp or IDC receptacle.
Key specs and what they mean for the fit
The 30.0 µin gold GXT™ plating on the mating surface is the feature that governs the real duty here — it supports repeated mating cycles and resists corrosion in moderate environments, so this header is a solid choice for field-serviceable boards or prototypes that see multiple connect-disconnect events. The 5 A per-contact rating is typical for a signal-level header at this pitch; the limiting factor in practice is the temperature rise of the thermoplastic housing, not the contact itself. The UL94 V-0 insulation material means the header is acceptable for equipment inside an enclosure requiring a flame rating. The 0.100" pitch and 0.100" row spacing define the board footprint — a standard 0.025" square pin grid that matches the BergStik and legacy 0.100" header ecosystem. The overall contact length of 0.445" (11.30 mm) with a 0.225" mating length and 0.120" solder post gives enough standoff for the mating receptacle to clear the board surface without interference.
Sourcing and lifecycle
The 75844-118-10LF carries an Active lifecycle status from Amphenol — full production, no end-of-life notice on record. No official replacement or cross-reference is recorded for this order code.