Amphenol FCI BergCon® 76308-130LF, 30-position single-row female receptacle, 0.100" (2.54 mm) pitch, through-hole solder termination, push-pull mating, gold-plated mating contacts (30.0 µin), tin-plated solder tails (78.7 µin), blue glass-filled polyester housing (UL94 V-0), insulation height 0.335", tube packaging.
| Parameter | Value |
|---|---|
| Series | BergCon® |
| Gender | Female Socket |
| Mounting type | Through Hole |
| Connector type | Receptacle |
| Fastening type | Push-Pull |
| Contact material | Brass |
| Insulation color | Blue |
| Insulation height | 0.335\" (8.51mm) |
| Insulation material | Thermoplastic, Polyester, Glass Filled |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board or Cable |
| Package | Tube |
| Termination | Solder |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 30 |
| Contact finish - post | Tin |
| Contact length - post | 0.135\" (3.43mm) |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 76308-130LF is a 30-position single-row receptacle from the BergCon® series, pitched at 0.100" (2.54 mm) — the standard grid for legacy and industrial board layouts. The through-hole solder tails (0.135" post length) suit wave-solder assembly on single- or double-sided boards.
The listed style is Board to Board or Cable — this 30-position BergCon® receptacle is designed for board-to-board or cable-interconnect applications at 0.100" pitch.