The 76314-123LF: The contact posts are tin-plated at 78.7 µinch (2.00 µm), which is a standard solderable finish. Insulation height of 0.335" (8.51 mm) sets the z-height above the board; plan for clearance under any mezzanine or shroud above the receptacle.
76314-123LF
76314-123LF BergCon® 46-Position Dual-Row Receptacle
MPN76314-123LF
Active
Amphenol ICC (FCI) BergCon® series, 46-position dual-row receptacle, 0.100" (2.54 mm) pitch, through-hole solder termination, 30 µinch gold on mating contacts, UL94 V-0 housing.
$11.3894Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
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Independent supplier — new & surplus connector stock· Listing updated Aug 2026
Specifications
| Parameter | Value |
|---|---|
| Series | BergCon® |
| Type | Female Socket |
| Mounting | Through Hole |
| Connector type | Receptacle |
| Fastening type | Push-Pull |
| Contact material | Brass |
| Insulation color | Blue |
| Insulation height | 0.335\" (8.51mm) |
| Insulation material | Thermoplastic, Polyester, Glass Filled |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board or Cable |
| Package | Tube |
All specifications
| Parameter | Value |
|---|---|
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 46 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.135\" (3.43mm) |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
Product details
Frequently asked questions
What is the closest pin-compatible alternative to 76314-123LF in the BergCon® series?
The BergCon® series includes many dual-row receptacles at 0.100" pitch, but position count (46) and gold plating (30 µinch) are specific to this order code. Confirm the BOM position count and mating half before substituting.