Amphenol ICC (FCI) BERGSTIK header, order code 77311-102-04, 4 positions, single row, 0.100" (2.54mm) pitch, unshrouded, through-hole, solder termination, gold or Gold GXT™ mating finish.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bulk |
| Parameter | Value |
|---|---|
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 4 |
| Contact finish - post | Tin-Lead |
| Contact length - post | 0.135\" (3.43mm) |
| Overall contact length | 0.465\" (11.81mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - post | 150.0µin (3.81µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 77311-102-04 is the 4-position member of Amphenol ICC (FCI)'s BERGSTIK board-to-board header line, single-row, unshrouded with push-pull fastening. Through-hole solder termination, UL94 V-0 thermoplastic insulation.
A board spin is required for a functional replacement.
The listed style is Board to Board, meaning it is designed to interconnect two PCBs in a parallel or perpendicular stack.
The series is BERGSTIK®, a Molex family of 0.100" pitch pin headers.