Board Layout Fit — 4 Pins, 2.54 mm Pitch
The 77311-127-04LF: The footprint is a row of four through-hole solder tails spaced 2.54mm apart — the same grid as legacy 0.100" prototyping and production boards.
Current and Contact Grade — 3 A with 30 µinch Gold
Rated 3 A per contact. It handles repeated mating without the fretting corrosion risk of tin-on-tin contacts in low-voltage circuits.
RoHS compliant.
