Through-hole unshrouded header
The 77311-883-20LF is the 20-position member of Amphenol ICC (FCI)'s BERGSTIK single-row unshrouded header line, designed for board-to-board stacking with a push-pull fastening interface. It carries a 0.100" (2.54 mm) pitch, 3 A per contact rating, gold or GXT plating on the mating side, and through-hole solder termination for manual or wave-solder assembly.
Unshrouded fit and board layout
With no shroud around the pins, the 0.100" (2.54 mm) insulation height leaves the mating interface exposed — the board footprint keeps the same 2.54 mm pitch as the rest of the BERGSTIK series, so the row spacing and hole pattern are consistent across sibling position counts. The single-row layout and 0.118" (3.00 mm) post length fit standard 1.6 mm PCBs; the UL94 V-0 thermoplastic housing handles the soldering thermal profile without distortion.