Amphenol ICC (FCI) BERGSTIK®, 77313-102S12LF, unshrouded dual-row header, 12 positions, 0.100" (2.54 mm) pitch, through-hole solder termination, gold or GXT™ mating finish, UL94 V-0 thermoplastic housing.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board or Cable |
| Package | Bulk |
| Parameter | Value |
|---|---|
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 12 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.135\" (3.43mm) |
| Overall contact length | 0.465\" (11.81mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 77313-102S12LF: The board footprint is a standard 2×6 grid — the same pattern used across the BERGSTIK family for wire-to-board or board-to-board interconnects.
The dual-metal plating strategy is common on BERGSTIK headers: gold where the connection is made, tin where the joint is soldered.
Lifecycle status is Active per the manufacturer.
The pitch is 0.100" (2.54 mm) on both the mating interface and row spacing. The header has 12 positions, all loaded, in a dual-row configuration.