The 77313-118-48LF: The through-hole solder tails measure 0.120" (3.05mm) long, enough to clear a 1.6mm board and still leave a visible fillet on the solder side. The 0.100" row spacing matches the pitch, so the pad pattern is a simple 2×24 grid. Board layout engineers can route one trace between pads on a standard 1 oz copper layer without necking down below 0.008" trace width.
Mating contacts are plated with gold or GXT™ over 30.0µinch (0.76µm) of nickel underplate. The solder tails are tin-plated (78.7µinch / 2.00µm), which wets well in lead-free wave or hand-solder processes. No need for a separate gold-flash step on the post.
Peer Comparison in the BERGSTIK® Line
The 77313-118-48LF sits alongside siblings 77313-118-26LF (26 positions) and 77313-118-16LF (16 positions) in the same dual-row, unshrouded, 0.100" pitch format.
