77313-120-12LF BERGSTIK 12-Position Dual-Row 2.54mm Male Header
Amphenol ICC (BERGSTIK) 77313-120-12LF; 0.100 inch pitch; 12 positions; 2 rows; 3A per contact; gold or GXT contact finish mating, tin solder tail; through-hole solder; male pin; 0.100 inch insulation height; UL94 V-0; -65°C to 130°C operating range.
Specifications
| Parameter | Value |
|---|---|
| Series | BERGSTIK® |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Current rating | 3A per Contact |
| Operating temperature | -65°C~130°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
All specifications
| Parameter | Value |
|---|---|
| Style | Board to Board or Cable |
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 12 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.120\" (3.05mm) |
| Overall contact length | 0.825\" (20.95mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.605\" (15.37mm) |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
Frequently asked questions
What is the pitch of the 77313-120-12LF and what does it mean for board layout?
The pitch is 0.100 inch (2.54 mm) — standard 2.54 mm grid spacing common across the BERGSTIK series and most DIP-compatible pin headers, meaning it fits standard 0.100 inch pitch through-hole footprints and aligns with common routing channel widths on two-layer boards.
What is the contact finish on the 77313-120-12LF and why does it matter?
The mating interface carries gold or Gold GXT plating at 30.0 µin (0.76 µm) over the phosphor bronze base; the solder post is tin at 78.7 µin (2.00 µm). Gold on the mating side extends cycle life and maintains low contact resistance at first mate — the tin tail keeps solder assembly straightforward and cost-effective.