70-Position Breakaway Header for Dense Board Interconnects
The 77313-129-70LF: The dual-row layout with 0.100" row spacing gives a compact footprint for dense signal routing on the PCB.

Amphenol ICC (FCI) BERGSTIK® series, 77313-129-70LF, unshrouded breakaway header, 70 positions, dual-row, 0.100" (2.54 mm) pitch, through-hole solder, male pin, 3 A per contact, gold or Gold GXT™ mating finish, UL94 V-0.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® |
| Gender | Male Pin |
| Mounting type | Through Hole |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Current rating | 3A per Contact |
| Operating temperature | -65°C~130°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board or Cable |
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 70 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.138\" (3.50mm) |
| Overall contact length | 0.925\" (23.50mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.687\" (17.46mm) |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 77313-129-70LF: The dual-row layout with 0.100" row spacing gives a compact footprint for dense signal routing on the PCB.
The part number suffix 'LF' indicates lead-free / RoHS-compliant termination finish. Confirm full compliance with your specific requirements at RFQ.