Amphenol ICC (FCI) BERGSTIK, 14-position, 0.100" (2.54mm) pitch, unshrouded breakaway header, dual-row, through-hole solder termination, 30 µinch gold on mating face, 3 A per contact, UL94 V-0 black thermoplastic, RoHS compliant.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Current rating | 3A per Contact |
| Operating temperature | -65°C~130°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Parameter | Value |
|---|---|
| Style | Board to Board or Cable |
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 14 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.118\" (3.00mm) |
| Overall contact length | 1.024\" (26.00mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.805\" (20.45mm) |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
Dual-row layout with 0.100" row spacing — the footprint is a 2×7 grid of 0.100"-centered holes. For wire-to-board applications, a 0.100" pitch crimp housing with 14 positions and 2 rows mates directly. The header is through-hole solder termination.
The part ships in bag packaging.
For wire-to-board applications, a 14-position, 2-row crimp housing accepting the matching terminal works.