Amphenol ICC (FCI) BERGSTIK header, order code 77313-852-72LF, 72 positions, dual row, 0.100" (2.54mm) pitch, 3A per contact, gold or GXT mating contact finish, through-hole, solder termination.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Current rating | 3A per Contact |
| Operating temperature | -65°C~130°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Parameter | Value |
|---|---|
| Style | Board to Board or Cable |
| Package | Bulk |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 72 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.120\" (3.05mm) |
| Overall contact length | 0.594\" (15.09mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.374\" (9.50mm) |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
The 77313-852-72LF is the 72-circuit member of Amphenol ICC's BERGSTIK breakaway header line, dual-row, unshrouded. Mating pitch is 0.100" (2.54mm) with gold or GXT contact finish, rated 3A per contact, through-hole solder termination.
The 77313-852-72LF is sourced to order against an RFQ through independent distribution. Availability and current pricing are confirmed at quote time; no stock-holding or factory-direct lead time claim is made on this listing.
No official pin-compatible cross-reference or alternate order code is listed for the 77313-852-72LF in this listing. The BERGSTIK series at 0.100-inch (2.54 mm) dual-row pitch is the series to cross-shop against — match the position count and row configuration to the BOM line requirement.
The mating contact finish on the 77313-852-72LF is gold or Gold GXT, at 15.0 µin (0.38 µm) thickness. The solder-post side is tin at 78.7 µin (2.00 µm).