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Amphenol 77315-418-31LF — Pin Headers, Sockets & Housings

77315-418-31LF BERGSTIK Header, 31 Pos, 0.100" Pitch

MPN77315-418-31LF
Active

Amphenol ICC FCI BERGSTIK® header, breakaway, order code 77315-418-31LF, 31 positions, single row, 0.100" (2.54mm) pitch, 3A per contact, tin-plated mating contacts, through-hole right-angle, solder termination.

$1.7423Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Aug 2026

Specifications

77315-418-31LF key specifications
ParameterValue
SeriesBERGSTIK®
TypeMale Pin
MountingThrough Hole, Right Angle
Connector typeHeader, Breakaway
Fastening typePush-Pull
Current rating3A per Contact
Operating temperature-65°C~125°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.094\" (2.40mm)
Insulation materialThermoplastic
Material flammability ratingUL94 V-0

All specifications

77315-418-31LF additional specifications
ParameterValue
StyleBoard to Board
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows1
Pitch0.100\" (2.54mm)
Positions31
Contact finish - postTin
Contact length - post0.120\" (3.05mm)
Contact finish - matingTin
Contact length - mating0.230\" (5.84mm)
Contact finish thickness - post78.7µin (2.00µm)
Contact finish thickness - mating78.7µin (2.00µm)

Product details

Amphenol ICC FCI BERGSTIK® header, breakaway, order code 77315-418-31LF, 31 positions, single row, 0.100" (2.54mm) pitch, 3A per contact, tin-plated mating contacts, through-hole right-angle, solder termination.

Frequently asked questions

What is the closest pin-compatible alternative to 77315-418-31LF in the BERGSTIK series?

No pin-compatible alternative is listed on record. The 31-position count is unique in the single-row BERGSTIK breakaway line; a different position count would require a different board footprint.