Amphenol FCI BERGSTIK 77315-801-28LF, 28-Position 3A Header
MPN77315-801-28LF
Active
Amphenol FCI BERGSTIK 77315-801-28LF header, 28 positions single row, 0.100" (2.54mm) pitch, right-angle through hole, gold or gold GXT mating contact, tin solder-tail finish, 3A per circuit.
$1.7449Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Jul 2026
Specifications
| Parameter | Value |
|---|---|
| Series | BERGSTIK® |
| Type | Male Pin |
| Mounting | Through Hole, Right Angle |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Current rating | 3A per Contact |
| Operating temperature | -65°C ~ 125°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.094\" (2.40mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
All specifications
| Parameter | Value |
|---|---|
| Style | Board to Board |
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 28 |
| Contact finish - post | Tin |
| Contact length - post | 0.101\" (2.57mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.225\" (5.72mm) |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
Frequently asked questions
Who supplies 77315-801-28LF and how is it quoted for volume purchases?
Sourced to order via RFQ through independent distribution — availability and current pricing are confirmed against the quote quantity, with no stock-holding claim or immediate-dispatch commitment.
What is 77315-801-28LF's listed style on this component line?
The listed style is Board to Board — configured as a breakaway header for board-to-board stacking applications.