The 77317-412-10: That pitch is the legacy standard for prototyping and low-density board layouts — the footprint is well-known and easy to route on two-layer boards.
For a BOM line that needs this exact footprint and pitch, the only channel is independent distribution — we source it per RFQ against the buyer's quantity.
Contact Finish and Mating Duty
Both the mating pin and the solder post carry tin-lead finish at 150.0 µinch (3.81 µm) thickness. Tin-lead is a workhorse finish for moderate reconnect cycles — expect 50-100 matings before contact resistance rises noticeably. It is not the choice for high-cycle field-service or corrosive environments; gold-over-nickel would be the upgrade path if the board layout allows a different part number.
