Plating Depth and Mating Cycle Life
The 77317-804-72LF: The mating finish is gold GXT™ at 15.0 µinch (0.38 µm) over the phosphor bronze base. For comparison, the sibling 77317-104-72LF carries 30.0 µinch gold on the mating face — double the thickness. In a build-to-print job where the connector is mated and unmated fewer than 50 cycles over the product life, the 15.0 µinch layer is sufficient. For a test fixture or a field-replaceable module cycled quarterly, the 30.0 µinch variant buys a wider corrosion margin and a higher cycle count before gold wear-through. The post (solder tail) finish is tin at 78.7 µinch (2.00 µm) — standard for through-hole solder joints and compatible with lead-free reflow profiles.
The insulator height above the board is 0.190" (4.83mm), which sets the keep-out zone for adjacent components on the solder side.