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Amphenol 77317-812-32LF — Pin Headers, Sockets & Housings

77317-812-32LF BERGSTIK Header, 32-Pos, 0.100" Pitch

MPN77317-812-32LF
Active

Amphenol ICC (FCI) BERGSTIK® 32-position dual-row unshrouded breakaway header, 0.100" (2.54 mm) pitch, right-angle through-hole termination, gold GXT™ mating finish, rated 3 A per contact.

$1.9035Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

77317-812-32LF key specifications
ParameterValue
SeriesBERGSTIK®
TypeMale Pin
MountingThrough Hole, Right Angle
Connector typeHeader, Breakaway
Fastening typePush-Pull
Current rating3A per Contact
Operating temperature-65°C~130°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.190\" (4.83mm)
Insulation materialThermoplastic
Material flammability ratingUL94 V-0

All specifications

77317-812-32LF additional specifications
ParameterValue
StyleBoard to Board
PackageBulk
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions32
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact length - post0.120\" (3.05mm)
Contact finish - matingGold, GXT™
Contact length - mating0.268\" (6.80mm)
Contact finish thickness - post78.7µin (2.00µm)
Contact finish thickness - mating15.0µin (0.38µm)

Product details

The 77317-812-32LF: The unshrouded design lets you snap off individual pin sections for custom row lengths, which consolidates several SKUs into one family.

Gold GXT Mating Finish and Contact Reliability

The mating surface carries 15.0 µinch (0.38 µm) gold over GXT™ — a palladium-nickel alloy underplate that resists fretting corrosion better than straight gold over nickel in high-vibration or repeated-mate applications. The post tail is tin-plated (78.7 µinch / 2.00 µm) for solderability.