Amphenol ICC (FCI) BERGSTIK® II, 78229-103HLF, unshrouded header, 3 circuits, 0.100" (2.54mm) pitch, through-hole, press-fit or solder termination, 30.0µin gold-plated male pins.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Insulation material | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bulk |
| Parameter | Value |
|---|---|
| Shrouding | Unshrouded |
| Termination | Press-Fit, Solder |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 3 |
| Contact length - post | 0.120\" (3.05mm) |
| Overall contact length | 0.538\" (13.67mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.318\" (8.08mm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 78229-103HLF: The through-hole termination supports either press-fit or solder assembly. Press-fit avoids the thermal stress of reflow on the board and is common in backplane builds where rework access is limited; solder tail gives a standard wave-solder process for lower-cost production.
Compare with the sibling 69190-202HLF, which carries 15.0µinch gold and is better suited for low-cycle, cost-sensitive builds.
The sibling 69190-202HLF is a 2-position version with 15.0µinch gold plating — half the gold thickness. For a 3-position header with the same 30.0µinch gold, the 68024-103HLF is a direct match but uses solder-only termination (no press-fit option).
Availability and current pricing confirmed at quote time.