It sits on the standard 0.100" (2.54 mm) pitch, single row, through-hole solder termination. Rated 5 A per contact with gold or GXT™ plating on the mating surface at 15.0 µin (0.38 µm) thickness, good for moderate cycle counts in a clean environment.
The 0.100" pitch matches the legacy 2.54 mm grid used across wire-wrap and IDC systems — the board footprint is a simple two-hole pattern on that spacing. Unshrouded headers like this one are common for low-cost, low-profile board stacking or as a programming/test header where the mating connector is only occasionally cycled. The UL94 V-0 rated black insulation handles the 5 A per contact without derating up to 125 °C, though in practice the current limit is set by the PCB trace width and the mating contact's own rating.