The Samtec 78511-208 is an 8-circuit, single-row unshrouded header from the BERGSTIK II series. It uses the standard 0.100" (2.54mm) pitch that matches legacy perf-board layouts and IDC ribbon cable footprints. Through-hole solder termination keeps the board-side connection simple and field-reworkable. The 5 A per-contact rating is typical for this pitch class — adequate for signal-level loads and low-power distribution, but not for bus-level current. Gold or Gold GXT plating at 15.0 µin (0.38 µm) on the mating surface gives it a solid cycle life for moderate mating duty in controlled environments.
Footprint and board fit
The 0.100" pitch and single-row layout mean the 8 positions occupy a compact 0.800" of board edge. The 0.318" (8.08mm) mating pin length provides enough wipe for standard receptacle housings. Overall contact length of 0.538" (13.67mm) with a 0.120" (3.05mm) post length gives a reasonable through-board standoff for hand-soldering or wave-solder processes. The unshrouded design means no keying — orientation is set by the board layout, and the pins are exposed for probing during bring-up.
Mating and compatibility
This header mates with any standard 0.100" pitch female socket strip or IDC receptacle — the unshrouded pins accept shrouded or unshrouded receptacles. The push-pull fastening type means no latch; retention relies on the contact friction of the mating half. For vibration-prone assemblies, a mating receptacle with a locking ramp or friction lock is worth specifying. The square male pins (0.025" square typical for this series) mate with standard crimp or machined socket contacts.
For a procurement decision: the 8-position count, 0.100" pitch, and through-hole termination are the three checks against the BOM. The gold plating grade (15.0 µin) is the standard commercial thickness — adequate for moderate mating cycles in clean environments, but not for high-cycle or corrosive-duty applications where a thicker gold or selective plating would be specified.