Board-to-Board Header, 16 Positions, 0.100" Pitch
The 78548-116HLF: The 0.100" row spacing matches standard 0.100" grid prototyping and production boards — the footprint is a direct drop-in for legacy 0.100" dual-row receptacles. At 30 µinch, the plating is rated for hundreds of mating cycles — a practical choice for equipment that sees periodic board swaps or field upgrades without the cost premium of heavy gold.
This is typical for board-to-board stacking where the receptacle is keyed or the PCB layout guides the pair.
No official pin-compatible alternative is listed by the manufacturer, so the BERGSTIK® II series is the direct source for this footprint.