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Amphenol 79257-422HLF — Pin Headers, Sockets & Housings

Amphenol ICC (FCI) 79257-422HLF BergStik II Header

MPN79257-422HLF
Active

Amphenol ICC (FCI) BergStik II header, order code 79257-422HLF, 22 positions, dual row, 0.100" (2.54 mm) pitch, 3 A, tin-plated mating contacts, through-hole right-angle, solder termination.

$2.1588Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Aug 2026

Specifications

79257-422HLF key specifications
ParameterValue
SeriesBERGSTIK® II
TypeMale Pin
MountingThrough Hole, Right Angle
Connector typeHeader
Fastening typePush-Pull
Current rating3A
Operating temperature-65°C~130°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.190\" (4.83mm)
Material flammability ratingUL94 V-0
StyleBoard to Board

All specifications

79257-422HLF additional specifications
ParameterValue
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions22
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact length - post0.120\" (3.05mm)
Contact finish - matingTin
Contact length - mating0.230\" (5.84mm)
Contact finish thickness - mating100.0µin (2.54µm)

Product details

Board-to-board unshrouded header, 22 circuits

The 79257-422HLF is the 22-circuit member of the Amphenol ICC (FCI) BergStik II unshrouded header line, dual-row, 0.100" (2.54 mm) pitch. Rated 3 A per contact with tin-plated mating surfaces (100.0 µin / 2.54 µm thickness), through-hole right-angle mounting, and a UL 94 V-0 black insulation body rated for -65°C to 130°C.

Pitch and footprint across the series

The 0.100" (2.54 mm) pitch and dual-row layout are shared across the BergStik II series — the 22-position 79257-422HLF sits between the 20-position and 24-position siblings at the same pitch, so the board footprint and routing density are consistent; only the circuit count changes.