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79257-422HLF — Amphenol product photo

Amphenol ICC (FCI) 79257-422HLF BergStik II Header

MPN79257-422HLF
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Amphenol ICC (FCI) BergStik II header, order code 79257-422HLF, 22 positions, dual row, 0.100" (2.54 mm) pitch, 3 A, tin-plated mating contacts, through-hole right-angle, solder termination.

$2.1588Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

79257-422HLF Technical Specifications
ParameterValue
SeriesBERGSTIK® II
GenderMale Pin
Mounting typeThrough Hole, Right Angle
Connector typeHeader
Fastening typePush-Pull
Current rating3A
Operating temperature-65°C~130°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.190\" (4.83mm)
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions22
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact length - post0.120\" (3.05mm)
Contact finish - matingTin
Contact length - mating0.230\" (5.84mm)
Contact finish thickness - mating100.0µin (2.54µm)

Product details

Board-to-board unshrouded header, 22 circuits

The 79257-422HLF is the 22-circuit member of the Amphenol ICC (FCI) BergStik II unshrouded header line, dual-row, 0.100" (2.54 mm) pitch. Rated 3 A per contact with tin-plated mating surfaces (100.0 µin / 2.54 µm thickness), through-hole right-angle mounting, and a UL 94 V-0 black insulation body rated for -65°C to 130°C.

Pitch and footprint across the series

The 0.100" (2.54 mm) pitch and dual-row layout are shared across the BergStik II series — the 22-position 79257-422HLF sits between the 20-position and 24-position siblings at the same pitch, so the board footprint and routing density are consistent; only the circuit count changes.