60-Position BERGSTIK® II Header for Board-to-Board Stacking
It uses the standard 0.100" (2.54 mm) square grid on both pitch and row spacing, which matches decades of legacy PCB layouts and allows direct replacement in existing footprints. All 60 positions are loaded with square male pins in phosphor bronze, terminated through-hole with solder tails 0.120" (3.05 mm) long. Rated 5 A per contact at 110 V, the header carries enough current for mixed signal and low-power distribution on a dense 60-way bus. The mating finish is 30.0 µ in (0.76 µm) gold over the contact area, giving it the cycle life for repeated mating in production test or field-replaceable card assemblies — a meaningful upgrade over tin-plated siblings in the same series.
The 0.100" pitch and row spacing define a through-hole footprint that takes a standard 60-position, dual-row pin pattern.