The Amphenol 79425-424HLF is a 24-position, dual-row unshrouded header from the BERGSTIK® II series, designed for board-to-board interconnects where a low-cost, through-hole solder termination is required. The 0.100" (2.54mm) pitch and 0.100" row spacing define a standard footprint that mates with matching receptacles or IDC sockets. Rated 5 A per contact at 110 V, with a UL94 V-0 rated black housing. The tin-plated mating finish at 100.0 µin thickness provides a corrosion-resistant surface suited for applications with limited mating cycles.
What the ratings mean for fit
The 0.100" pitch and 0.100" row spacing are the industry-standard grid for many BergStik-compatible receptacles — the footprint is well-established, so board layout risk is low. The 5 A per contact rating is typical for signal-level interconnects; the limiting factor is the tin plating, not the contact cross-section. Tin contacts are rated for fewer mating cycles than gold — plan this header for one-time assembly or infrequent rework, not repeated field service.
Mating and termination
This is an unshrouded header with a push-pull fastening type. It mates with any standard 0.100" pitch dual-row receptacle or IDC socket that accepts 0.025" square pins. The through-hole solder termination has a post length of 0.120" (3.05mm) and an overall contact length of 0.410" (10.41mm). All 24 positions are loaded.