Product Introduction
The Amphenol BERGSTIK® II 79425-468HLF is a 68-position, dual-row, unshrouded male pin header designed for board-to-board interconnect applications on a standard 0.100" (2.54mm) pitch grid. This through-hole solder-terminated header carries tin-plated phosphor bronze square pins rated for 5A per contact at 110V, with a full 100.0µin (2.54µm) tin finish on the mating surface for reliable contact in cost-optimized designs. The unshrouded push-pull fastening and UL94 V-0 black insulation suit it for internal board stacking where the mating receptacle provides the polarization.
The 0.100" (2.54mm) pitch and 0.100" row spacing match the standard DIP footprint — board layout is straightforward with no special keep-out zones. The 68 positions are fully loaded across two rows of 34 pins each, with a mating pin length of 0.190" (4.83mm) and a post length of 0.120" (3.05mm) for the solder tail. Overall contact length is 0.410" (10.41mm), and the insulation height above the board is 0.100" (2.54mm). The 5A per-contact rating at 110V is typical for signal-level interconnect; the limiting factor in a dense 68-pin array is the cumulative temperature rise, not the individual contact capacity.
The push-pull fastening means the mating half provides the retention — expect a friction fit from the receptacle contacts. Tin-on-tin mating is suitable for designs with limited disconnect cycles; for frequent mating, a gold-plated receptacle is recommended to reduce contact wear.
