It uses a 0.100" (2.54mm) pitch on both the pin-to-pin and row spacing, which keeps the footprint compatible with standard 0.100" grid prototyping and production boards. The through-hole solder termination and 0.200" (5.08mm) post length suit it for conventional wave-solder assembly or hand-soldering into plated through-holes. The 30.0µin (0.76µm) gold or GXT™ plating on the mating surface provides a corrosion-resistant, low-resistance interface for repeated mating cycles — the gold thickness is well into the range that handles regular board separation and reconnection without fretting.
This header mates with a standard BERGSTIK II female socket or a dual-row receptacle that accepts 0.025" square pins on 0.100" centers. The overall contact length of 0.730" (18.54mm) splits into a 0.430" (10.92mm) mating interface and a 0.200" (5.08mm) solder tail — the mated stack height depends on the chosen receptacle's insulation height. With a typical 0.100" (2.54mm) receptacle body, the board-to-board gap lands around 0.530" (13.46mm) before accounting for board thickness.