Amphenol BergStik® II, 79821-124HLF, Board to Board Header, 24 Positions, 2 Row, 0.100" (2.54mm) Pitch, Through Hole, Solder, Unshrouded, Male Pin, Gold or GXT™ Mating Finish, UL94 V-0.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Voltage rating | 110V |
| Current rating | 5A |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Parameter | Value |
|---|---|
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 24 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact length - post | 0.200\" (5.08mm) |
| Overall contact length | 0.730\" (18.54mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.430\" (10.92mm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The header is through-hole soldered, with male square pins that mate with a matching BergStik receptacle or other 0.100" pitch female socket strip. Typical uses include signal-level board stacking, I/O card connections, and internal harness headers in industrial control, telecom, and computing equipment.
For a build-to-print assembly, you will need the mating receptacle housing and separate crimp or IDC terminals; the header itself is soldered directly to the PCB.
The 79821-124HLF mates with any standard 0.100" (2.54 mm) pitch dual-row female socket strip, such as a BergStik II receptacle. The connection is unshrouded and uses push-pull retention.
The 79821-124HLF is listed as RoHS compliant by the manufacturer.