The Amphenol 86503-106HLF is a 6-position, dual-row unshrouded header from the BERGSTIK® II series. It uses a standard 0.100" (2.54mm) pitch on both the mating interface and row spacing — the same grid as perfboard and legacy DIP footprints, so board layout is straightforward. The through-hole solder termination and push-pull fastening make it a no-fuss interconnect for board-to-board stacking or wire-to-board applications when paired with a matching receptacle.
What the Ratings Mean for the Fit
The 0.100" pitch is the defining dimension — it sets the board footprint to a 2.54mm grid, which means the mating receptacle must also be on that pitch. The 6 positions are fully loaded across 2 rows, so the footprint is a 2x3 array of plated through-holes. The 5A per-contact rating is typical for signal-level power; at this pitch, the limiting factor is the temperature rise in the housing, not the phosphor bronze contact itself. The 30.0µin gold plating on the mating surface gives good corrosion resistance and supports repeated mating cycles — useful if this header lives on a modular board that gets swapped.
Sourcing and Lifecycle
The 86503-106HLF carries an Active lifecycle status from Amphenol — no end-of-life notice, no last-time-buy pressure.