The Amphenol FCI 86503-120HLF is a BERGSTIK II series dual-row unshrouded male header, 20 positions all loaded, on the standard 0.100" (2.54 mm) pitch. It's a through-hole solder header with square pins, push-pull fastening, and a black UL94 V-0 rated housing. Typical use is as a board-to-board interconnect — the unshrouded design keeps the profile low and gives you access to the pins for probing or manual wiring.
What the ratings mean for the fit
The 0.100" pitch and 0.100" row spacing are the classic DIP footprint — your board layout matches a standard 0.100" grid, and the 20 positions line up with a 20-pin IDC socket or a mating receptacle on the same pitch. The 5 A per contact rating is typical for signal-level current on a header this size; it'll handle logic power and I/O without trouble, but it's not a power bus connector. The 30 µ" gold on the mating surface is the real workhorse spec here — that thickness supports hundreds of mating cycles without the contact fretting you'd see with tin plating on a board that gets swapped regularly. The 110 V rating keeps it in the low-voltage signal domain.
Sourcing and lifecycle
The 86503-120HLF carries an Active lifecycle status from Amphenol FCI — no end-of-life notice on record. No official cross-reference or successor has been published, so the BERGSTIK II series is the direct source for this footprint.