Board-to-Board Interconnect: 24-Position BergStik II Header
The FCI / Amphenol 86503-124HLF is a 24-position, dual-row unshrouded header from the BergStik® II series, designed for board-to-board and wire-to-board interconnect applications. It uses a standard 0.100" (2.54 mm) square grid on both pitch and row spacing, making it footprint-compatible with a wide range of industry-standard receptacles. The male pins are square, phosphor bronze with a 30.0 µin gold or GXT™ mating finish, rated for 5 A per contact at 110 V. The through-hole solder termination and 0.120" post length suit it for standard PCB thicknesses.
Key Specs and What They Mean for the Fit
The 24 positions loaded across two rows at 0.100" pitch define the PCB footprint — a 24-pin, dual-row layout with 0.100" row spacing. The unshrouded push-pull design means there is no polarization key or locking latch; the header relies on the mating receptacle's internal retention. The 30.0 µin gold on the mating surface is the feature that governs real-world duty: it supports repeated mating cycles and resists corrosion in industrial or field-service environments better than a tin-plated equivalent. The UL94 V-0 rated black housing meets the flame-retardant requirement for equipment inside an enclosure.
Mating and Termination
This unshrouded header mates with standard 0.100" pitch box-style receptacles, including IDC sockets and crimp-housing receptacles from the BergStik and similar families. The through-hole solder termination requires no special tooling beyond a wave or hand solder process. The 0.250" mating length provides sufficient engagement depth for most standard receptacles.