It uses a 0.100" (2.54 mm) pitch on both rows and contacts, with a 0.100" row spacing. Typical applications include signal routing between parallel boards in industrial control, telecom, and computing equipment.
Rated 5 A per contact at 110 V, the 86503-130HLF carries enough headroom for dense signal lines — the current limit is driven by the contact cross-section and housing thermal rise, not the plating. The 30.0 µin (0.76 µm) gold plating on the mating surface handles repeated mating cycles without oxidation, making it a solid choice for production boards that see multiple test-and-rework passes before final assembly. The mating receptacle must provide the alignment and polarization. The 0.250" (6.35 mm) mating contact length gives a generous wipe range for standard board-to-board spacing.